Heat Shrink

150 C Heat Shrink Tubing

Halogen-free, flame-retardant high-temperature tubing for electronics, communications, vehicles, ships and aircraft manufacturing.

Heat Shrink

150 C Heat Shrink Tubing

150 C heat shrink tubing for high-temperature wire protection, flame-retardant insulation and durable harness finishing in demanding OEM assemblies.

150 C Heat Shrink Tubing Heat Shrink

Typical Parameters

ParameterTypical value
MaterialRadiation-crosslinked halogen-free polyolefin
Working temperature-55 C to 150 C
Voltage / dielectric600 V class, 2500 V / 1 min withstand
Size rangeHeat shrink sizes from 0.6/0.35 to 150/70 mm
StructureSingle-wall high-temperature heat shrink tubing

OEM note: Detailed size table, validation data and custom packing can be confirmed by project.

Why this product

  • Built for high-temperature heat shrink tubing projects that exceed general-purpose wire protection needs.
  • Supports OEM teams comparing flame retardancy, heat aging and stable shrink performance.
  • Useful for electronics, vehicle wiring, communications and compact high-heat cable assemblies.

Typical applications

  • Vehicle, ship and aircraft harness protection
  • Electronics, communications and industrial cable finishing
  • High-temperature wiring and export OEM assembly projects

Product Inquiry

Discuss 150 C Heat Shrink Tubing with Wahchangwei.

Frequently Asked Questions

Frequently Asked Questions

What is 150 C Heat Shrink Tubing used for?

150 C Heat Shrink Tubing is used for electrical insulation, cable branch covering, terminal protection, harness finishing and sealing or strain relief when the selected construction fits the project.

How should I compare 150 C Heat Shrink Tubing options?

Compare shrink ratio, recovered size, wall type, adhesive requirement, environment, installation process and the validation standard required by the customer.

What should I send for 150 C Heat Shrink Tubing samples?

Send the cable or terminal size, starting and recovered diameter target, length, color, sealing requirement, environment and expected assembly method.