Heat Shrink

Dual-wall Adhesive Heat Shrink

Waterproof sealing and fixation for connectors, terminals and wire exits.

Heat Shrink

Dual-wall Adhesive Heat Shrink

Dual-wall adhesive heat shrink for waterproof sealing, connector protection, wire-exit insulation and strain relief in harness and cable assemblies.

Dual-wall Adhesive Heat Shrink Heat Shrink

Typical Parameters

ParameterTypical value
MaterialPolyolefin with hot-melt adhesive
Working temperature-45 C to 125 C
Voltage / dielectricDielectric strength >=15 kV/mm, volume resistivity >=10^14 ohm-cm
Size range2:1 / 3:1 common ratios
StructureDual-wall adhesive-lined heat shrink tube

OEM note: Detailed size table, validation data and custom packing can be confirmed by project.

Why this product

  • Designed for dual-wall adhesive heat shrink projects that need both insulation and moisture sealing.
  • Helps engineering teams protect connectors, terminals and branch exits exposed to water, oil or vibration.
  • Useful for sourcing evaluation of shrink ratio, adhesive performance and wire-exit sealing reliability.

Typical applications

  • Automotive and EV connector sealing
  • Wire harness branch points, cable repairs and terminal exits
  • Industrial equipment and outdoor electrical protection projects

Product Inquiry

Discuss Dual-wall Adhesive Heat Shrink with Wahchangwei.

Frequently Asked Questions

Frequently Asked Questions

What is Dual-wall Adhesive Heat Shrink used for?

Dual-wall Adhesive Heat Shrink is used for electrical insulation, cable branch covering, terminal protection, harness finishing and sealing or strain relief when the selected construction fits the project.

How should I compare Dual-wall Adhesive Heat Shrink options?

Compare shrink ratio, recovered size, wall type, adhesive requirement, environment, installation process and the validation standard required by the customer.

What should I send for Dual-wall Adhesive Heat Shrink samples?

Send the cable or terminal size, starting and recovered diameter target, length, color, sealing requirement, environment and expected assembly method.